Tapeout Engineer / Senior Engineer (Frame / Prime Data - GaKKerjaID

Vacant Job Information

Tapeout Engineer / Senior Engineer (Frame / Prime Data

Accelerate Your Future...Be Part of the Leading-Edge Technology

We are looking for motivated and skilled people who want to be part of a diverse organisation and a driving force behind the next generation of the high-growth foundry industry. Headquartered in Singapore, Chartered Semiconductor Manufacturing serves a global customer base from the Americas, Europe and Asia. Chartered has five world-class fabrication facilities in Singapore - including the Company's first 300mm facility.

Tapeout Engineer / Senior Engineer (Frame / Prime Data)
(Singapore - Woodlands[Map])

Job Purpose:
Support Field Engineering, Technology Development, Electronic Design Automation and CHRT Express in the area of pre-tapeout and tapeout phases of prototype.

Responsibilities:

   * Provide technical support to Field Engineer / CHRT Express to ensure customer requirements/demands are implemented.
   * Provide technical support to Module Engineer/Process Integration engineer to ensure all requirements and changes are implemented.
   * Execute tapeout activities to ensure timely and accurate tapeout, including but not limited to the following:
         o Obtain Process Bias Table
         o Generate frame, perform job view on generated Frame
         o Create Job deck file for mask vendor and provide mask vendor with mask tooling instruction
         o Interface with mask vendor to ensure all data are received and feedback if there is any problems
         o Create Stepper Tooling Form and wafer map
         o Perform Job view on fractured data
         o All requirements are implemented and optimized


   * Review and improve Frame tapeout procedure/ flow for tapeout requirement.
   * Lead and execute improvement projects for tapeout requirement.
   * Mentor and Coach AE/Senior AE on Frame tapeout activities.
   * Prioritize Frame tapeout activities for the team to ensure cycle time commitment met.

Requirements:

   * Diploma in Electrical, Electronics Engineering, Microelectronics, Computer Science, Physics or equivalent.
   * At least 2 years of experience in wafer fabrication or IC design or Frame Design environment.
   * Good inter-personal and communication skills are necessary.
   * Able to interact effectively with both external and internal customers at all levels and from various cultural background.
   * Good PSDM skill.
We regret that only shortlisted candidates will be notified.

Advertised on 12-3-08. ReAlerted on 26-3-08. Application deadline on 25-4-08.

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